The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Aug. 26, 2022
Senju Metal Industry Co., Ltd., Tokyo, JP;
Takahiro Yokoyama, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
Provided are a solder alloy and a solder joint, which have a narrow ΔT to suppress solder bridges and solder icicles, and a small amount of dross generated in a solder tank, suppress Cu leaching, and have higher strength. The solder alloy has an alloy composition of, by mass %, Cu: more than 2.0% and less than 3.0%; Ni: 0.010% or more and less than 0.30%; and Ge: 0.0010 to 0.20% with the balance being Sn. Preferably, by mass %, Cu is more than 2.5% and less than 3.0%, and the alloy composition satisfies the following relations (1) and (2): 2.400≤Cu+Ni+Ge≤3.190 (1), and 0.33≤Ge/Ni≤1.04 (2). Cu, Ni, and Ge in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.