The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Sep. 12, 2017
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Ken Tachibana, Tokyo, JP;
Hikaru Nomura, Tokyo, JP;
Yuki Iijima, Tokyo, JP;
Takashi Saito, Tokyo, JP;
Takahiro Yokoyama, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Naoko Izumita, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01); C22C 13/02 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0244 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3457 (2013.01); H05K 3/3463 (2013.01);
Abstract
A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, and optionally Fe: 0.005 to 0.015% and P: 0.1% or less, with the balance being Sn.