Yuki Iijima

Title: Yuki Iijima: Innovator in Solder Alloy Technology

Introduction

Yuki Iijima is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of solder alloy technology, holding a total of 2 patents. His work focuses on developing advanced materials that enhance the performance and reliability of solder joints in various applications.

Latest Patents

Yuki Iijima's latest patents include innovations in solder alloy, solder ball, solder preform, solder paste, and solder joint. One of his notable inventions features a solder alloy with a specific composition consisting of, in mass %, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La, and Ce: 0.1% or less in total, with the balance being Sn. This alloy composition satisfies a specific relationship that enhances its performance in soldering applications.

Another patent focuses on a solder alloy with a composition that includes Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, with the balance being Sn. This innovation aims to improve the efficiency and effectiveness of solder joints in electronic devices.

Career Highlights

Yuki Iijima is currently employed at Senju Metal Industry Co., Ltd., where he continues to develop cutting-edge solder materials. His expertise in alloy composition and solder technology has positioned him as a key player in the industry.

Collaborations

Yuki collaborates with talented coworkers, including Hikaru Nomura and Takashi Saito, who contribute to the innovative environment at Senju Metal Industry Co., Ltd. Their combined efforts drive advancements