Senju Metal Industry Co., Ltd.

Yuki Iijima

Takashi Saito

Shunsaku Yoshikawa

Hikaru Nomura

Naoko Izumita

Takahiro Yokoyama

Ken Tachibana

A solder alloy has an alloy composition consisting of, in mass %, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La and Ce: 0.1% or less in total, with the balance being Sn. The alloy composition satisfies the following relationship (1): 2.93&#x2264;{(Ge/Sn)+(Bi/Ge)}&#xd7;(Bi/Sn) (1). In the relationship (1), each of Sn, Ge, and Bi represents the content (mass %) in the alloy composition.

Solder alloy, solder ball, solder preform, solder paste and solder joint

A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, and optionally Fe: 0.005 to 0.015% and P: 0.1% or less, with the balance being Sn.

Solder alloy, solder ball, and solder joint

Growing community of inventors

Tokyo, Japan

Yuki Iijima