The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Feb. 22, 2019
Senju Metal Industry Co., Ltd., Tokyo, JP;
Takahiro Yokoyama, Saitama, JP;
Takahiro Matsufuji, Tokyo, JP;
Hikaru Nomura, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.