The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Dec. 26, 2018
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Takahiro Yokoyama, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 2103/08 (2018.08);
Abstract
A solder alloy has an alloy composition including, in mass %, 0.8% to 10% of Cu and Sn. The solder alloy includes an intermetallic compound. The intermetallic compound has a maximum grain size of 100 μm or less in a region at least 50 μm away from a surface of the solder alloy.