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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Stephan Alan Cohen

This inventor holds 32 USPTO granted patents and 3 published patent applications. Top assignees: International Business Machines Corporation, Applied Materials, Inc.. Active years: 1996-2024.

USPTO Granted Patents = 32 

% Patents Active = 75.0

Average Co-Inventor Count = 3.2

ph-index = 9

Forward Citations = 531(Granted Patents)


Location History:

  • Yorktown Heights, NY (US) (2013)
  • Wappingers Falls, NY (US) (1996 - 2019)
  • Dallas, TX (US) (2017 - 2024)

Company Filing History:

goldMedal29 out of 166,209 
 
International Business Machines Corporation
 patents
silverMedal2 out of 14,403 
 
Applied Materials, Inc.
 patents
where one patent can have more than one assignee

Years Active: 1996-2024

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Areas of Expertise:
Drum Stick
Low-Resistivity Metallic Interconnect Structures
Shallow Trench Isolation
Nanoscale Interconnect Structure
Multilayered Low K Cap
Engineered Interconnect Dielectric Caps
Diffusion Barrier Layer
DUV Laser Annealing
Ultra Thin Diffusion Barrier
Low K Dielectric Materials
Chip Interconnect Wiring Structure
Diamond-Like Carbon
32 patents (USPTO):Explore Patents
1. D1009983 - Drum stick (2024-01-02),
2. 10224242 - Low-resistivity metallic interconnect structures (2019-03-05),
3. 10204823 - [object Object] (2019-02-12),
4. 9922866 - [object Object] (2018-03-20),
5. 9698043 - Shallow trench isolation for semiconductor devices (2017-07-04),
6. 9613900 - Nanoscale interconnect structure (2017-04-04),
7. D781371 - Drumstick grip pattern (2017-03-14),
8. D779812 - Drumstick bag (2017-02-28),
9. 9281211 - Nanoscale interconnect structure (2016-03-08),
10. 9006895 - Interconnect structures containing nitrided metallic residues (2015-04-14),
11. 8962479 - Interconnect structures containing nitrided metallic residues (2015-02-24),
12. 8536069 - Multilayered low k cap with conformal gap fill and UV stable compressive stress properties (2013-09-17),
13. 8492880 - Multilayered low k cap with conformal gap fill and UV stable compressive stress properties (2013-07-23),
14. 8362596 - Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same (2013-01-29),
15. 7256146 - Method of forming a ceramic diffusion barrier layer (2007-08-14),

Title: The Innovative Journey of Stephan Alan Cohen

Introduction:

Stephan Alan Cohen, a prolific inventor based in Wappingers Falls, NY, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 29 patents, Cohen's work has been instrumental in advancing low-resistivity metallic interconnect structures in semiconductor devices.

Latest Patents:

Cohen's latest patents showcase his expertise in developing innovative solutions for the semiconductor industry. His work on low-resistivity metallic interconnect structures involves the use of sacrificial dielectric layers, metallic materials, heat treatment processes, conformal liner layers, and dielectric encapsulation. These advancements aim to improve the performance and reliability of semiconductor devices.

Career Highlights:

Throughout his career, Stephan Alan Cohen has worked for renowned companies such as IBM (International Business Machines Corporation) and Applied Materials, Inc. His tenure at these industry giants has allowed him to collaborate with top professionals and gain valuable experience in semiconductor technology.

Collaborations:

Cohen has had the privilege of working alongside esteemed colleagues such as Alfred Grill and Stephen McConnell Gates. These collaborations have not only enriched his work but have also led to groundbreaking innovations in the field of semiconductor technology.

Conclusion:

In conclusion, Stephan Alan Cohen's dedication to innovation and his relentless pursuit of excellence have positioned him as a key player in the semiconductor industry. His patents and collaborations stand as a testament to his remarkable contributions to the field, paving the way for future advancements in semiconductor technology.

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