The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Sep. 12, 2012
Mihaela Balseanu, Cupertino, CA (US);
Stephan A. Cohen, Wappingers Falls, NY (US);
Alfred Grill, White Plains, NY (US);
Thomas J. Haigh, Jr., Claverack, NY (US);
Son V. Nguyen, Schenectady, NY (US);
Li-qun Xia, Cupertino, CA (US);
Mihaela Balseanu, Cupertino, CA (US);
Stephan A. Cohen, Wappingers Falls, NY (US);
Alfred Grill, White Plains, NY (US);
Thomas J. Haigh, Jr., Claverack, NY (US);
Son V. Nguyen, Schenectady, NY (US);
Li-Qun Xia, Cupertino, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
The present disclosure provides a multilayered cap (i.e., migration barrier) that conforms to the substrate (i.e., interconnect structure) below. The multilayered cap, which can be located atop at least one interconnect level of an interconnect structure, includes, from bottom to top, a first layer comprising silicon nitride and a second layer comprising at least one of boron nitride and carbon boron nitride.