The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
May. 13, 2005
Stephan A. Cohen, Wappingers Falls, NY (US);
Stephen Mcconnell Gates, Ossining, NY (US);
Jeffrey C. Hedrick, Montvale, NJ (US);
Elbert E. Huang, Tarrytown, NY (US);
Dirk Pfeiffer, Dobbs Ferry, NY (US);
Stephan A. Cohen, Wappingers Falls, NY (US);
Stephen McConnell Gates, Ossining, NY (US);
Jeffrey C. Hedrick, Montvale, NJ (US);
Elbert E. Huang, Tarrytown, NY (US);
Dirk Pfeiffer, Dobbs Ferry, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention comprises an interconnect structure including a metal, interlayer dielectric and a ceramic diffusion barrier formed therebetween, where the ceramic diffusion barrier has a composition SiNCOH, where 0.1≦v≦0.9, 0≦w≦0.5, 0.01≦x≦0.9, 0≦y≦0.7, 0.01≦z≦0.8 for v+w+x+y+z=1. The ceramic diffusion barrier acts as a diffusion barrier to metals, i.e., copper. The present invention also comprises a method for forming the inventive ceramic diffusion barrier including the steps depositing a polymeric preceramic having a composition SiNCOH, where 0.1<v<0.8, 0<w<0.8, 0.05<x<0.8, 0<y<0.3, 0.05<z<0.8 for v+w+x+y+z=1 and then converting the polymeric preceramic layer into a ceramic diffusion barrier by thermal methods.