IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Shunsuke Teranishi

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.2

ph-index = 1


Company Filing History:

goldMedal14 out of 1,552 
 
Disco Corporation
 patents
silverMedal1 out of 1 
 
Disco Corportation
 patent

Years Active: 2019-2025

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15 patents (USPTO):Explore Patents
1. 12424456 - Method of manufacturing package device (2025-09-23),
2. 12383982 - Laminated device wafer forming method (2025-08-12),
3. 12354995 - Laminated device chip manufacturing method (2025-07-08),
4. 12322655 - Method of manufacturing layered device chip assembly (2025-06-03),
5. 12304109 - Method of separating wafer (2025-05-20),
6. 12300545 - Wafer manufacturing method and laminated device chip manufacturing method (2025-05-13),
7. 12198990 - Wafer manufacturing method and laminated device chip manufacturing method (2025-01-14),
8. 12170224 - Method of processing wafer (2024-12-17),
9. 11854891 - Wafer manufacturing method and laminated device chip manufacturing method (2023-12-26),
10. 11764115 - Wafer manufacturing method and laminated device chip manufacturing method (2023-09-19),
11. 11764114 - Wafer manufacturing method and laminated device chip manufacturing method (2023-09-19),
12. 11756831 - Wafer manufacturing method and laminated device chip manufacturing method (2023-09-12),
13. 11456260 - Wafer processing method (2022-09-27),
14. 11417570 - Wafer processing method (2022-08-16),
15. 10249547 - Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layer (2019-04-02),

Title: Shunsuke Teranishi: Innovator in Package Device Manufacturing

Introduction

Shunsuke Teranishi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of package device manufacturing, holding a total of 15 patents. His innovative methods have advanced the technology used in the production of electronic devices.

Latest Patents

Among his latest patents is a method of manufacturing package devices. This method includes several steps, such as preparing a first substrate with device chips, preparing a second substrate with recessed portions, bonding the two substrates, grinding to expose the recessed portions, and finally, resin molding to cover the device chips. Another notable patent is the laminated device wafer forming method, which involves laminating two device wafers while ensuring precise alignment using predetermined lines.

Career Highlights

Shunsuke Teranishi has worked with notable companies, including Disco Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the industry.

Collaborations

Throughout his career, Teranishi has collaborated with talented individuals such as Akihito Kawai and Youngsuk Kim. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Shunsuke Teranishi's work in package device manufacturing showcases his dedication to innovation and excellence. His patents reflect a deep understanding of technology and a commitment to advancing the field.

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