The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Aug. 20, 2021
Disco Corporation, Tokyo, JP;
Shunsuke Teranishi, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of processing a wafer includes a groove forming step of forming grooves in the wafer to a depth equal to or larger than a thickness of chips to be produced from the wafer from a face side of the wafer along projected dicing lines, a separation initiating point forming step of positioning a focused spot of a laser at a depth in the wafer corresponding to a thickness of the chips from a reverse side of the wafer, applying the laser beam to the wafer while moving the focused spot and the wafer relatively to each other, thereby forming separation initiating points in the wafer that are parallel to the face side of the wafer and made up of modified layers and cracks, and a chip peeling step of peeling off the chips from the wafer at the separation initiating points.