Toyama, Japan

Shunsuke Moriya

USPTO Granted Patents = 10 

 

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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10 patents (USPTO):Explore Patents

Title: Shunsuke Moriya: Pioneering Innovations for Diverse Industries

Introduction:

Throughout his illustrious career, Shunsuke Moriya has established a commendable record of achievement as an inventor. Hailing from Toyama, Japan, Moriya has made significant contributions to various industries with his practical and impactful inventions. Holding an impressive track record of five patents, his work reflects a steadfast commitment to technological advancement. In this article, we will explore Moriya's latest patents, career highlights, and notable collaborations.

Latest Patents:

1. Adhesive Agent Composition, Layered Product, and Production Method for Layered Product:

Moriya's innovative approach to bonding substrates has resulted in a patent for an adhesive composition capable of forming a peelable layer. Specifically, the composition includes a component (A) cured through hydrosilylation and a peeling component (B) containing an epoxy-modified polyorganosiloxane. This patent opens up possibilities for sealed bonding between semiconductor-forming substrates and support substrates, ultimately enhancing the manufacturing process in the semiconductor industry.

2. Method for Reducing Thickness of Semiconductor Forming Substrate:

Moriya's expertise in the semiconductor field has also resulted in a patent for a method to reduce the thickness of semiconductor forming substrates. By utilizing his developed adhesive composition, this method offers a solution to achieving thinner substrates without compromising their functionality. This innovation has the potential to revolutionize the semiconductor industry by enabling the production of more compact and energy-efficient devices.

Career Highlights:

Shunsuke Moriya's impact extends beyond his patent portfolio. As an esteemed member of the Nissan Chemical Corporation, his expertise has influenced various aspects of the company's advancements. Through his inventive contributions, Moriya has played a vital role in shaping the research and development activities of the organization, pushing the boundaries of innovation in the field of chemicals and materials.

Collaborations:

Moriya's creative journey has been enriched through collaborations with talented professionals who share his passion for innovation. Notably, he has worked closely with colleagues such as Tetsuya Shinjo and Hiroshi Ogino, fostering an environment of collective learning and idea exchange. These collaborations have nurtured a vibrant ecosystem where ideas are forged into groundbreaking inventions that have the potential to reshape industries.

Conclusion:

Shunsuke Moriya's career stands as a testament to his unwavering commitment to technological advancement and inventive thinking. With a portfolio of notable patents, including his adhesive agent composition and method for reducing substrate thickness, Moriya has made lasting contributions to the semiconductor industry. His expertise and collaborations underscore his dedication to pushing the boundaries of innovation. As we look to the future, we can anticipate further groundbreaking inventions from this visionary inventor that will continue to impact diverse industries worldwide.

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