The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Apr. 23, 2019
Nissan Chemical Corporation, Tokyo, JP;
Kazuhiro Sawada, Toyama, JP;
Shunsuke Moriya, Toyama, JP;
Tetsuya Shinjo, Toyama, JP;
Hiroshi Ogino, Toyama, JP;
Takahisa Okuno, Toyama, JP;
NISSAN CHEMICAL CORPORATION, Tokyo, JP;
Abstract
A temporary adhesive without the formation of voids between a support and a wafer. A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive including a component (A) that is cured by a hydrosilylation reaction; a polymerization inhibitor (B) having a 5% mass decrease temperature of 80° C. or higher as measured using a Tg-DTA; and a solvent (C). The component (A) may include a polysiloxane (A1) including a polyorganosiloxane (a1) containing a Calkyl group and a Calkenyl group, and a polyorganosiloxane (a2) containing a Calkyl group and a hydrogen atom; and a platinum group metal-based catalyst (A2). The polymerization inhibitor (B) may be a compound of formula (1): (wherein Rand Rare each a Caryl group, or a combination of a Calkyl group and a Caryl group).