Toyama, Japan

Hiroshi Ogino

This inventor holds 18 USPTO granted patents and 15 published patent applications and 4 EPO patents, primarily in Semiconductor Cleaning. Top assignees: Nissan Chemical Corporation, Nissan Chemical Industries Limited. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Ogino. Retrieved from https://idiyas.com/inventor/hiroshi-ogino-680g1dpg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.7

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2016-2026

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Areas of Expertise:
Cleaning Agent Composition
Temporary Adhesive
Polysiloxane
Semiconductor Substrate
Peeling Composition
Heat-Resistant Polymerization
Light Irradiation
Passivation Film
Fluorine-Containing Ammonium
Novolac Resin
Carbon-Carbon Bonds
18 patents (USPTO):Explore Patents

Title: Innovations by Hiroshi Ogino: Pioneering Temporary Adhesives

Introduction

Hiroshi Ogino is a prominent inventor based in Toyama, Japan, with a remarkable portfolio of ten patents. His innovative contributions primarily focus on advanced adhesive materials, which have significant applications in various industries, particularly in electronics.

Latest Patents

Among his latest inventions is a temporary adhesive containing epoxy-modified polysiloxane. This adhesive boasts excellent spin coating properties, making it ideal for the circuit side of a wafer and its support. It exhibits remarkable heat resistance, enabling a seamless attachment process during wafer rear surface processing. Once the polishing is complete, the unique formulation allows for easy separation of the circuit side from the support—enhancing efficiency in manufacturing processes. The adhesive comprises a component (A), cured by a hydrosilylation reaction, and a component (B), an epoxy-modified polyorganosiloxane, in a precise mass ratio of 99.995:0.005 to 30:70, with the latter exhibiting an epoxy value ranging from 0.1 to 5. Another notable patent includes an adhesive composition designed for peeling off by irradiation with light. This composition facilitates debonding through light irradiation and incorporates an adhesive component alongside a light-absorbing organic compound, enriching the performance and versatility of adhesive applications.

Career Highlights

Hiroshi Ogino has contributed significantly to the field of adhesives through his work at Nissan Chemical Corporation and Nissan Chemical Industries Limited. His innovative mindset and dedication to enhancing adhesive technologies have positioned him as a leader in the industry. His patents play a crucial role in advancing production methodologies and improving material properties.

Collaborations

Throughout his career, Hiroshi Ogino has collaborated with talented individuals such as Tetsuya Shinjo and Shunsuke Moriya. These collaborations have fostered a creative and productive environment that has led to the successful development of groundbreaking adhesive products.

Conclusion

Hiroshi Ogino's innovative contributions to adhesive technology continue to leave a significant impact on the industry. His patents, particularly those involving epoxy-modified polysiloxane, showcase his dedication to enhancing performance and usability in manufacturing processes. As he continues to innovate, the potential applications of his work promise to benefit various sectors, highlighting the importance of his role as an inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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