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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12617978 B1

PDFFull Text
Date of Patent:
May. 05, 2026

Filed:

Mar. 22, 2021

Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling

Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Takahisa Okuno, Toyama, JP;

Masaki Yanai, Toyama, JP;

Takuya Fukuda, Toyama, JP;

Hiroto Ogata, Toyama, JP;

Shunsuke Moriya, Toyama, JP;

Hiroshi Ogino, Toyama, JP;

Tetsuya Shinjo, Toyama, JP;

Assignee:

NISSAN CHEMICAL CORPORATION, Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Eisa B Elhilo

Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 5/00 (2006.01); C11D 7/26 (2006.01); C11D 7/50 (2006.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 5/00 (2013.01); C11D 7/266 (2013.01); C11D 7/5022 (2013.01); H10P 72/7402 (2026.01); C09J 2203/326 (2013.01); C09J 2301/502 (2020.08); C09J 2483/00 (2013.01); C11D 2111/22 (2024.01);
Abstract

The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, each of Land Lrepresents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group Land that of the alkyl group Lis 6 or less) in an amount of 80 mass % or more.

Find Patent Forward Citations

Okuno, Takahisa. (2026). Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling (U.S. Patent No. 12617978). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12617978

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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