The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Aug. 20, 2021
Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Takahisa Okuno, Toyama, JP;

Yuki Usui, Toyama, JP;

Hiroto Ogata, Toyama, JP;

Shunsuke Moriya, Toyama, JP;

Masaki Yanai, Toyama, JP;

Tetsuya Shinjo, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); C09J 7/40 (2018.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
H10P 72/74 (2026.01); C09J 7/405 (2018.01); C09J 183/04 (2013.01); C09J 2203/326 (2013.01); C09J 2301/312 (2020.08); H10P 72/7416 (2026.01); H10P 72/7444 (2026.01);
Abstract

The laminate of the invention has a semiconductor substrate, a support substrate, a release layer disposed so as to come into contact with the semiconductor substrate, and an adhesive layer disposed between the support substrate and the release layer, characterized in that the release layer is a film formed from a releasing agent composition containing a polyorganosiloxane component essentially containing polydimethylsiloxane; the polyorganosiloxane component has a viscosity of 5.50×10Pa·s to 0.75×10Pa·s, as measured at 25° C.; and the film has a thickness of 0.01 μm to 4.90 μm.


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