Shu-Ting Tsai

This inventor holds 60 USPTO granted patents and 8 published patent applications, primarily in 3DIC Interconnects (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shu-Ting Tsai. Retrieved from https://idiyas.com/inventor/shu-ting-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 60 (Patent Applications = 8)

% Patents Active = 93.3

Average Co-Inventor Count = 6.1

ph-index = 7

Forward Citations = 160(Granted Patents)

Forward Citations (Not Self Cited) = 117(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Kaoshiung, TW (2012 - 2013)
Kaohsiun, TW (2016 - 2018)
Kaohsiung, TW (2012 - 2024)

Company Filing History:

60 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

3DIC Interconnect

BSI Image Sensor

Semiconductor Devices

Stacked Device

Global Shutter

Interconnect Structure

Manufacturing Methods

Multi-Wafer Stacking

Conductive Plugs

Barrier Layer

Ox-Ox Bonding

Image Sensor Devices

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12734368 - Interconnect structure and method of forming same (2026-09-15),

2. 12727263 - Backside illumination imaging sensor and methods of manufacturing (2026-09-01),

3. 12476224 - 3DIC interconnect apparatus and method (2025-11-18),

4. 12381195 - Semiconductor devices and methods of manufacture thereof (2025-08-05),

5. 11916091 - BSI image sensor and method of forming same (2024-02-27),

6. 11915977 - Interconnect structure for stacked device (2024-02-27),

7. 11798916 - 3DIC interconnect apparatus and method (2023-10-24),

8. 11769781 - Backside illuminated global shutter image sensor (2023-09-26),

9. 11596800 - Interconnect structure and method of forming same (2023-03-07),

10. 11315972 - BSI image sensor and method of forming same (2022-04-26),

11. 11018177 - Backside illuminated global shutter image sensor (2021-05-25),

12. 11011567 - Structure and method for 3D image sensor (2021-05-18),

13. 10978345 - Interconnect structure for stacked device (2021-04-13),

14. 10861899 - Interconnect structure for stacked device and method (2020-12-08),

15. 10847560 - BSI image sensor and method of forming same (2020-11-24),

Title: The Innovative Journey of Shu-Ting Tsai

Introduction: Shu-Ting Tsai, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Tsai's latest patents include a cutting-edge AI-powered healthcare device, a revolutionary renewable energy system, and a state-of-the-art communication technology.

Career Highlights: With a career spanning over two decades, Tsai has been at the forefront of technological advancements. He has worked with renowned tech companies and research institutions, leading teams to develop innovative solutions.

Collaborations: Tsai has collaborated with top universities and research institutions worldwide to further his inventions. His partnerships have resulted in the successful development and commercialization of several pioneering technologies.

Conclusion: Shu-Ting Tsai's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his position as a visionary inventor in the global tech industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

8 patents pending: