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Hirakata, Japan

Shinji Tachibana

USPTO Granted Patents = 11

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 61(Granted Patents)

Location History:

Nishinomiya, JP (1994)
Osaka, JP (2002 - 2017)
Hirakata, JP (2007 - 2022)

Company Filing History:

C.uyemura Co., Ltd.

Takeda Chemical Industries, Inc.

Mitsubishi Gas Chemical Company, Inc.

where one patent can have more than one assignee

Years Active: 1994-2022

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11389818 - Surface treatment apparatus and surface treatment method (2022-07-19),

2. 9730337 - Plating method (2017-08-08),

3. 9028668 - Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath (2015-05-12),

4. 8801912 - Continuous copper electroplating method (2014-08-12),

5. 8679317 - Copper electroplating bath (2014-03-25),

6. 7988842 - Continuous copper electroplating method (2011-08-02),

7. 7892411 - Electrolytic copper plating process (2011-02-22),

8. 7507587 - Automatic analysis and control system for electroless composite plating solution (2009-03-24),

9. 7220347 - Electrolytic copper plating bath and plating process therewith (2007-05-22),

10. 6352775 - Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same (2002-03-05),

11. 5298559 - Multi-layered polymers (1994-03-29),

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