IDiyas

For the Inventor, By the Inventor

Osaka, Japan

C.uyemura Co., Ltd.


USPTO Granted Patents = 125


Trademarks = 16

Forward Citations = 961

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185 inventors (with patents filed for the assignee):

goldMedal Masayuki Utsumi (15 out of 15 patents)

silverMedal Hisamitsu Yamamoto (14 out of 14 patents)

bronzeMedal Yutaka Sugiura (13 out of 13 patents)

4.  Masayuki Kiso (13 out of 13 patents)

5.  Teruyuki Hotta (11 out of 11 patents)

6.  Tomoji Okuda (10 out of 10 patents)

7.  Shinji Tachibana (9 out of 11 patents)

8.  Yoshikazu Saijo (9 out of 11 patents)

9.  Naoyuki Omura (9 out of 9 patents)

10.  Ken Araki (9 out of 9 patents)

11.  Katsuhisa Tanabe (8 out of 8 patents)

12.  Tetsuro Uemura (8 out of 8 patents)

13.  Hiroki Uchida (8 out of 8 patents)

14.  Yukinori Oda (7 out of 7 patents)

15.  Takahiro Ishizaki (7 out of 7 patents)


Core Competencies:
Electroless Plating
Surface Treatment
Palladium Plating
Copper Electrolytic Plating
Printed Wiring Board
Ultrasonic Treatment
Conductive Bump
X-Ray Fluorescence Analysis
Aluminum Alloy Treatment
Catalyst Application
Turbulence Reduction
Shaft Member Manufacturing

125 patents:

1. 12454760 - Etchant and method of surface treatment of aluminum or aluminum alloy (2025-10-28),
2. 11946144 - Electroless palladium plating solution (2024-04-02),
3. 11891714 - Holding apparatus (2024-02-06),
4. 11891698 - Turbulence-reducing device for stirring a surface treatment solution (2024-02-06),
5. 11887882 - Holding jig (2024-01-30),
6. 11814717 - Palladium plating solution and plating method (2023-11-14),
7. 11718916 - Electroless Co—W plating film (2023-08-08),
8. 11560640 - Filling plating system and filling plating method (2023-01-24),
9. 11492706 - Electroless palladium plating solution and palladium film (2022-11-08),
10. 11427923 - Workpiece holding jig and loading and unloading apparatus (2022-08-30),
11. 11421325 - Method for producing a printed wiring board (2022-08-23),
12. 11415167 - Shaft member and manufacturing method of shaft member (2022-08-16),
13. 11389818 - Surface treatment apparatus and surface treatment method (2022-07-19),
14. 11248305 - Copper electrolytic plating bath and copper electrolytic plating film (2022-02-15),
15. 11173513 - Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereof (2021-11-16),
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USPTO Data Jan 1 1976 - Dec 9 2025

125 Patents

#92 in Osaka

#955 in Japan

#6,212 in the World

...
Osaka, Japan

C.uyemura Co., Ltd.

Forward Citations = 961

185 inventors:

goldMedal Masayuki Utsumi (15 out of 15 patents)

silverMedal Hisamitsu Yamamoto (14 out of 14 patents)

bronzeMedal Yutaka Sugiura (13 out of 13 patents)

4.  Masayuki Kiso (13 out of 13 patents)

5.  Teruyuki Hotta (11 out of 11 patents)

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