The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Feb. 15, 2019
C. Uyemura & Co., Ltd., Osaka, JP;
Tetsuya Sasamura, Osaka, JP;
Tatsushi Someya, Osaka, JP;
Katsuhisa Tanabe, Osaka, JP;
Shinsuke Wada, Osaka, JP;
Eriko Furuya, Osaka, JP;
C. UYEMURA & CO., LTD., Osaka, JP;
Abstract
An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NHNHCOR(1), (NHNHCO)(R)n (2), wherein Rrepresents H, NH, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH, or an aromatic group, wherein each of these groups may have a substituent; Rrepresents (CH) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.