Location History:
- Hirakata, JP (2020)
- Osaka, JP (2021 - 2022)
Company Filing History:
Years Active: 2020-2022
Title: Tetsuya Sasamura: Innovator in Electroless Palladium Plating Solutions
Introduction
Tetsuya Sasamura is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of plating solutions, particularly in the development of electroless palladium plating technologies. With a total of 3 patents to his name, Sasamura's work has had a considerable impact on the industry.
Latest Patents
Sasamura's latest patents include an innovative electroless palladium plating solution and a film formation method. The electroless palladium plating liquid he developed contains hydrazine or a salt thereof as a reducing agent. This solution exhibits excellent bath stability in the acidity to neutrality range and long-term stability. It is also capable of suppressing the decrease in the palladium film deposition rate caused by the elution of etching resist. The formulation includes a palladium compound, hydrazine or its salt, and specific compounds that enhance its effectiveness. The film formation method involves a catalyst film formation step, an intermediate film formation step for palladium plating, and a surface film formation step for gold plating.
Career Highlights
Tetsuya Sasamura is currently employed at C. Uyemura Co., Ltd., where he continues to innovate in the field of plating solutions. His expertise and dedication to research have positioned him as a key figure in his company and the industry at large.
Collaborations
Sasamura has collaborated with notable colleagues, including Tatsushi Someya and Katsuhisa Tanabe. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Tetsuya Sasamura's contributions to electroless palladium plating solutions highlight his role as an influential inventor in the field. His patents reflect a commitment to advancing technology and improving industrial processes.