C.uyemura Co., Ltd.

Tetsuya Sasamura

Katsuhisa Tanabe

Eriko Furuya

Tatsushi Someya

Hiroki Okubo

Naoshi Nishimura

Shinsuke Wada

An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NHNHCOR(1), (NHNHCO)(R)n (2), wherein Rrepresents H, NH, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH, or an aromatic group, wherein each of these groups may have a substituent; Rrepresents (CH) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.

Electroless palladium plating solution and palladium film

A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.

Film formation method

An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.

Growing community of inventors

Osaka, Japan

Tetsuya Sasamura