The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
May. 23, 2022
Applicant:
C. Uyemura & Co., Ltd., Osaka, JP;
Inventors:
Shoji Iguchi, Aichi, JP;
Akio Itamura, Aichi, JP;
Shoichi Fukui, Aichi, JP;
Yukinori Oda, Osaka, JP;
Masaaki Sato, Osaka, JP;
Yoshihito Il, Osaka, JP;
Hiroki Okubo, Osaka, JP;
Assignee:
C. UYEMURA & CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/32 (2006.01); C23C 18/00 (2006.01); C23C 30/00 (2006.01); C22C 19/00 (2006.01); C22C 19/07 (2006.01); B32B 15/04 (2006.01); C23C 18/36 (2006.01); C23C 18/34 (2006.01); C23C 18/54 (2006.01); C23C 18/50 (2006.01); C23C 18/48 (2006.01); C23C 18/18 (2006.01);
U.S. Cl.
CPC ...
C23C 18/32 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); C22C 19/00 (2013.01); C22C 19/07 (2013.01); C23C 18/34 (2013.01); C23C 18/36 (2013.01); C23C 18/48 (2013.01); C23C 18/50 (2013.01); C23C 18/54 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C23C 18/1844 (2013.01); Y10T 428/1284 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/265 (2015.01);
Abstract
An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.