Osaka, Japan

Masaaki Sato

USPTO Granted Patents = 1 


Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Masaaki Sato: Innovator in Electroless Plating Technology

Introduction

Masaaki Sato is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electroless plating, particularly with his innovative patent that addresses the challenges of solder diffusion in metal conductors. His work has implications for various industries, including electronics and materials science.

Latest Patents

Masaaki Sato holds a patent for an electroless Co—W plating film. The objective of this invention is to provide a new electroless plating film that can effectively prevent the diffusion of molten solder to a metal material constituting a conductor. The electroless Co—W plating film has a tungsten content ranging from 35 to 58 mass % and a minimum thickness of 0.05 μm.

Career Highlights

Throughout his career, Masaaki Sato has worked with prominent companies such as C. Uyemura Co., Ltd. and Panasonic Corporation. His experience in these organizations has allowed him to develop and refine his expertise in plating technologies.

Collaborations

Masaaki Sato has collaborated with notable colleagues, including Shoji Iguchi and Akio Itamura. These partnerships have contributed to the advancement of his research and innovations in the field.

Conclusion

Masaaki Sato's contributions to electroless plating technology highlight his role as an influential inventor. His patent for the electroless Co—W plating film demonstrates his commitment to addressing industry challenges and advancing material science.

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