Osaka, Japan

Yoshihito Il

This inventor holds 1 USPTO granted patent. Top assignee: C.uyemura Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshihito Il. Retrieved from https://idiyas.com/inventor/yoshihito-il

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Yoshihito Il: Innovator in Electroless Plating Technology

Introduction

Yoshihito Il is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the development of innovative plating technologies. His work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Yoshihito Il holds a patent for an electroless Co—W plating film. The objective of this invention is to provide a new electroless plating film that can prevent the diffusion of molten solder to a metal material constituting a conductor. The electroless Co—W plating film has a tungsten content ranging from 35 to 58 mass % and a thickness of 0.05 μm or more. This innovation is crucial for improving the durability and functionality of electronic devices.

Career Highlights

Yoshihito Il is currently employed at C.uyemura Co., Ltd., where he continues to advance his research and development efforts. His expertise in electroless plating has positioned him as a key figure in the industry, contributing to the company's reputation for innovation and quality.

Collaborations

Yoshihito has collaborated with notable colleagues, including Shoji Iguchi and Akio Itamura. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Yoshihito Il's contributions to electroless plating technology exemplify his commitment to innovation in materials science. His patent for the electroless Co—W plating film represents a significant advancement in the field, showcasing his expertise and dedication to improving electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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