The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Dec. 26, 2017
C. Uyemura & Co., Ltd., Osaka, JP;
C. Uyemura & Co., Ltd., Osaka, JP;
Abstract
The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.