The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Oct. 03, 2018
Applicant:

C. Uyemura & Co., Ltd., Osaka, JP;

Inventors:

Tsuyoshi Maeda, Osaka, JP;

Katsuhisa Tanabe, Osaka, JP;

Tomohiro Kawahara, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/44 (2006.01); C09D 5/00 (2006.01); C09D 5/02 (2006.01);
U.S. Cl.
CPC ...
C23C 18/44 (2013.01); C09D 5/00 (2013.01); C09D 5/024 (2013.01);
Abstract

An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.


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