The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Jul. 21, 2010
Toshihisa Isono, Hirakata, JP;
Naoyuki Omura, Hirakata, JP;
Koji Shimizu, Hirakata, JP;
Shinji Tachibana, Hirakata, JP;
Toshihisa Isono, Hirakata, JP;
Naoyuki Omura, Hirakata, JP;
Koji Shimizu, Hirakata, JP;
Shinji Tachibana, Hirakata, JP;
C. Uyemura & Co., Ltd, Osaka-Shi, Osaka, JP;
Abstract
For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.