Hirakata, Japan

Koji Shimizu


Average Co-Inventor Count = 5.1

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2011-2015

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4 patents (USPTO):Explore Patents

Title: Koji Shimizu: Innovator in Electroplating Technology

Introduction

Koji Shimizu is a notable inventor based in Hirakata, Japan. He has made significant contributions to the field of electroplating technology, holding a total of 4 patents. His work focuses on improving the efficiency and effectiveness of copper plating processes, which are essential in the manufacturing of circuit boards.

Latest Patents

Shimizu's latest patents include an electrolytic copper plating bath and a method for electroplating using this bath. This innovation is designed for circuit boards where both through holes and blind via holes are present. The electrolytic copper plating bath is composed mainly of a water-soluble copper salt, sulfuric acid, and chloride ions. It also includes a polyamide polyamine, which acts as a leveler, ensuring adequate covering power and plugging performance.

Another significant patent is a continuous copper electroplating method. This method allows for repeated electroplating of a workpiece using an insoluble anode in a copper sulfate plating bath. The process involves transferring the plating bath between a copper dissolution vessel and the plating vessel, ensuring a continuous supply of copper ions while preventing defective plating due to performance-impairing components.

Career Highlights

Koji Shimizu is currently employed at C. Uyemura Co., Ltd., where he continues to develop innovative solutions in electroplating technology. His expertise has positioned him as a key figure in advancing the capabilities of copper plating processes.

Collaborations

Shimizu has collaborated with notable coworkers, including Toshihisa Isono and Naoyuki Omura. Their combined efforts contribute to the ongoing development of advanced electroplating techniques.

Conclusion

Koji Shimizu's contributions to electroplating technology demonstrate his commitment to innovation in the field. His patents reflect a deep understanding of the complexities involved in copper plating, making him a valuable asset to the industry.

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