The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Aug. 07, 2008
Shinji Tachibana, Hirakata, JP;
Tomohiro Kawase, Hirakata, JP;
Naoyuki Omura, Hirakata, JP;
Toshihisa Isono, Hirakata, JP;
Koji Shimizu, Hirakata, JP;
Shinji Tachibana, Hirakata, JP;
Tomohiro Kawase, Hirakata, JP;
Naoyuki Omura, Hirakata, JP;
Toshihisa Isono, Hirakata, JP;
Koji Shimizu, Hirakata, JP;
C. Uyemura & Co., Ltd., Osaka-shi, JP;
Abstract
Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm·min based on the immersed area.