The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2009

Filed:

Nov. 28, 2005
Applicants:

Tadashi Chiba, Hirakata, JP;

Koji Monden, Nagoya, JP;

Kazuki Yoshikawa, Hirakata, JP;

Shinji Tachibana, Hirakata, JP;

Inventors:

Tadashi Chiba, Hirakata, JP;

Koji Monden, Nagoya, JP;

Kazuki Yoshikawa, Hirakata, JP;

Shinji Tachibana, Hirakata, JP;

Assignee:

C.Uyemura Co., Ltd., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); G01N 21/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

An automatic analysis and control system for electroless composite plating solution for automatically analyzing an electroless composite plating solution and performing such a control as to obtain an appropriate bath composition and/or use conditions, wherein, as a technique for measuring the concentration of a metallic component in the plating solution by absorptiometry, the system includes a mechanism for measuring transmissivity or absorbance at least two or more different wavelengths after the plating solution is automatically introduced into an analytical cell, and a mechanism for calculating the objective concentration from the measured values and displaying the calculation results.


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