The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Jul. 15, 2005
Toshihisa Isono, Hirakata, JP;
Shinji Tachibana, Hirakata, JP;
Tomohiro Kawase, Hirakata, JP;
Naoyuki Omura, Hirakata, JP;
Toshihisa Isono, Hirakata, JP;
Shinji Tachibana, Hirakata, JP;
Tomohiro Kawase, Hirakata, JP;
Naoyuki Omura, Hirakata, JP;
C. Uyemura & Co., Ltd., Osaka-shi, JP;
Abstract
An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an additive, wherein the leveler is either one or both of a quaternary polyvinylimidazolium compound represented by the following formula (1) and a copolymer, represented by the following formula (2), of vinylpyrrolidone and a quaternary vinylimidazolium compound: where Rand Rare each an alkyl group, m is an integer of not less than 2, and p and q are each an integer of not less than 1, and a copper electroplating method for via-filling plating of blind via-holes formed on a substrate by use of the electrolytic copper plating bath.