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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9730337 B1

PDFFull Text
Date of Patent:
Aug. 08, 2017

Filed:

May. 22, 2012

Plating method

Applicants:

Toshihisa Isono, Osaka, JP;

Shinji Tachibana, Osaka, JP;

Naoyuki Omura, Osaka, JP;

Kanako Matsuda, Osaka, JP;

Inventors:

Toshihisa Isono, Osaka, JP;

Shinji Tachibana, Osaka, JP;

Naoyuki Omura, Osaka, JP;

Kanako Matsuda, Osaka, JP;

Assignee:

C. UYEMURA & CO., LTD., Osaka, JP;

Attorney:

Norris McLaughlin & Marcus, P.A.

Primary Examiner:

Brian K Talbot

Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 3/42 (2006.01); C23C 18/16 (2006.01); C25D 5/02 (2006.01); C25D 21/10 (2006.01); C25D 21/12 (2006.01); C25D 17/00 (2006.01); C23C 4/12 (2016.01); B05D 1/02 (2006.01); H05K 3/12 (2006.01); H05K 3/10 (2006.01); C25D 3/38 (2006.01); C23C 18/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/422 (2013.01); C23C 18/161 (2013.01); C23C 18/1628 (2013.01); C23C 18/1669 (2013.01); C23C 18/1675 (2013.01); C23C 18/1683 (2013.01); C25D 5/026 (2013.01); C25D 17/00 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01); H05K 3/423 (2013.01); B05D 1/02 (2013.01); B05D 5/12 (2013.01); C23C 4/12 (2013.01); C23C 18/38 (2013.01); C25D 3/38 (2013.01); H05K 3/107 (2013.01); H05K 3/1258 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/075 (2013.01); H05K 2203/081 (2013.01); H05K 2203/1518 (2013.01); H05K 2203/1554 (2013.01); H05K 2203/1563 (2013.01);
Abstract

The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.

Find Patent Forward Citations

Isono, Toshihisa. (2017). Plating method (U.S. Patent No. 9730337). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9730337

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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