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For the Inventor, By the Inventor

Taipei, Taiwan

Shih-Wei Sun

USPTO Granted Patents = 54

Average Co-Inventor Count = 2.0

ph-index = 17

Forward Citations = 1,333(Granted Patents)

Forward Citations (Not Self Cited) = 1,306(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Taipei City, TW (1999 - 2000)
  • Hsin-Chu, TW (1999 - 2011)
  • Taipei, TW (1998 - 2014)

Company Filing History:

goldMedal51 out of 7,087 
 
United Microelectronics Corp.
 patents
silverMedal3 out of 832,891 
Other
 patents

Years Active: 1998-2014

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Areas of Expertise:
High Density Plasma Chemical Vapor Deposition
CMOS Device Fabrication
Dual Damascene Structure
Interconnect Structure
Chemical Mechanical Polishing
Embedded DRAM Fabrication
Dynamic Random Access Memory
Metal-Oxide Semiconductor
Self-Aligned Contact Window
Multi-Layer Metal Capacitor
Silicon on Insulator Technology
Differential Gate Oxide Thickness
54 patents (USPTO):Explore Patents
1. 8624435 - Power regulating apparatus (2014-01-07),
2. 8062536 - High density plasma chemical vapor deposition process (2011-11-22),
3. 7718079 - High density plasma chemical vapor deposition process (2010-05-18),
4. 7615434 - CMOS device and fabricating method thereof (2009-11-10),
5. 7514014 - High density plasma chemical vapor deposition process (2009-04-07),
6. 7378740 - Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit (2008-05-27),
7. 7271101 - High density plasma chemical vapor deposition process (2007-09-18),
8. 7078346 - High density plasma chemical vapor deposition process (2006-07-18),
9. 6492732 - Interconnect structure with air gap compatible with unlanded vias (2002-12-10),
10. 6492256 - Method for forming an interconnect structure with air gap compatible with unlanded vias (2002-12-10),
11. 6362101 - Chemical mechanical polishing methods using low pH slurry mixtures (2002-03-26),
12. 6350672 - Interconnect structure with gas dielectric compatible with unlanded vias (2002-02-26),
13. 6265780 - Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit (2001-07-24),
14. 6245380 - Method of forming bonding pad (2001-06-12),
15. 6242346 - Metallization for uncovered contacts and vias (2001-06-05),

Title: The Innovative Journey of Shih-Wei Sun

Introduction:

Shih-Wei Sun, a pioneering inventor hailing from Taipei, Taiwan, is a remarkable woman whose inventive spirit has led to groundbreaking creations in various fields.

Latest Patents:

Shih-Wei Sun's latest patents include advancements in renewable energy technologies, medical devices, and sustainable materials, showcasing her diverse range of interests and expertise.

Career Highlights:

Throughout her illustrious career, Shih-Wei Sun has been recognized for her innovative contributions to the fields of biotechnology, electronics, and environmental conservation. Her inventions have not only improved the quality of life for many but have also set new standards for technological advancement.

Collaborations:

Shih-Wei Sun has collaborated with leading research institutions, universities, and companies worldwide to further develop and commercialize her inventions. Her collaborative efforts have resulted in the successful implementation of cutting-edge technologies in various industries.

Conclusion:

In conclusion, Shih-Wei Sun's relentless pursuit of innovation and her passion for creating solutions to complex challenges have established her as a prominent figure in the world of inventors. Her dedication to pushing the boundaries of what is possible continues to inspire future generations of inventors and innovators.

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