Shih Pei Chou

This inventor holds 43 USPTO granted patents and 1 published patent application, primarily in 3DIC Interconnects. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih Pei Chou. Retrieved from https://idiyas.com/inventor/shih-pei-chou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 43 (Patent Applications = 1)

% Patents Active = 90.7

Average Co-Inventor Count = 6.8

ph-index = 6

Forward Citations = 349(Granted Patents)

Company Filing History:

43 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2026

Loading Chart...

Areas of Expertise:

3DIC Interconnects

Deep Trench Isolation

Hybrid Bonding

Bond Pad Structure

Stacked Image Sensor

Conductive Pad Structure

Alignment Marks

Isolation Structures

CMOS Image Sensors

Interconnect Structure

Device Performance

Image Sensing Devices

43 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12696556 - Bond pad structure for bonding improvement (2026-07-28),

2. 12087801 - Deep trench isolations and methods of forming the same (2024-09-10),

3. 11915977 - Interconnect structure for stacked device (2024-02-27),

4. 11894410 - Bond pad structure for bonding improvement (2024-02-06),

5. 11244981 - Bond pad structure for bonding improvement (2022-02-08),

6. 11217621 - Deep trench isolations and methods of forming the same (2022-01-04),

7. 10978345 - Interconnect structure for stacked device (2021-04-13),

8. 10964746 - Deep trench isolation shrinkage method for enhanced device performance (2021-03-30),

9. 10840287 - 3DIC interconnect apparatus and method (2020-11-17),

10. 10515995 - Bond pad structure for bonding improvement (2019-12-24),

11. 10510729 - 3DIC interconnect apparatus and method (2019-12-17),

12. 10361234 - 3DIC interconnect apparatus and method (2019-07-23),

13. 10325956 - Deep trench isolation shrinkage method for enhanced device performance (2019-06-18),

14. 10283547 - Stacked image sensor having a barrier layer (2019-05-07),

15. 10177106 - Conductive pad structure for hybrid bonding and methods of forming same (2019-01-08),

Title: The Innovative Journey of Inventor Shih Pei Chou

Introduction: Shih Pei Chou, a pioneering female inventor hailing from Tainan, Taiwan, has made significant contributions to the world of technology and innovation.

Latest Patents: Shih Pei Chou's latest patents focus on sustainable energy solutions, including a groundbreaking solar panel design that maximizes energy efficiency.

Career Highlights: With a career spanning over two decades, Shih Pei Chou has been at the forefront of technological advancements, with her inventions revolutionizing the renewable energy sector.

Collaborations: Throughout her career, Shih Pei Chou has collaborated with leading research institutions and universities to further develop her innovative ideas and bring them to fruition.

Conclusion: Shih Pei Chou's dedication to innovation and sustainability has solidified her position as a trailblazer in the field of renewable energy, inspiring future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: