The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Dec. 06, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Sin-Yao Huang, Tainan, TW;
Ching-Chun Wang, Tainan, TW;
Dun-Nian Yaung, Taipei, TW;
Feng-Chi Hung, Chu-Bei, TW;
Ming-Tsong Wang, Taipei, TW;
Shih Pei Chou, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Some embodiments relate an integrated circuit (IC). The IC includes a first substrate including an array of photodetectors, wherein a bond pad opening extends through the first substrate and is defined by an inner sidewall of the first substrate. An interconnect structure is disposed over the first substrate and includes a plurality of metal layers stacked over one another and disposed within a dielectric structure. The bond pad opening further extends through at least a portion of the interconnect structure and is further defined by an inner sidewall of the interconnect structure. A bond pad structure directly contacts a metal layer of the plurality of metal layers in the interconnect structure and is located at an uppermost extent of the bond pad opening.