Shigeru Konishi

Title: Shigeru Konishi: Innovator in High Thermal Conductivity Substrates

Introduction: Shigeru Konishi, based in Annaka, Japan, is a prominent inventor with a remarkable portfolio of 18 patents. His innovative work primarily focuses on high thermal conductivity substrates, crucial in the fields of electronics and material engineering. Konishi’s inventive approaches have made significant strides in enhancing device efficiency and thermal management.

Latest Patents: Among his latest contributions, Konishi has developed groundbreaking methods regarding the transfer of device layers onto substrates. One patent details a method of transferring a device layer to a transfer substrate, resulting in a highly thermal conductive substrate. This substrate is formed by bonding a device layer on a silicon on insulator (SOI) wafer to an insulator substrate with a thermal conductivity of 40 W/m·K or more, utilizing a low-stress adhesive. The patent specifies precise thickness requirements for both the buried oxide film and the adhesive.

Another significant patent by Konishi describes the creation of a device substrate with high thermal conductivity. This substrate is designed for improved heat dissipation and reduced loss at high frequencies. The manufacturing method involves provisional bonding, removal of the silicon base substrate, and transfer-bonding processes, ensuring the final product meets high-performance standards in thermal management.

Career Highlights: Shigeru Konishi's career is marked by his association with Shin-Etsu Chemical Co., Ltd., where he has been instrumental in driving innovation in substrate technology. His patents reflect a deep understanding of materials science and engineering, contributing to the advancement of semiconductor technologies.

Collaborations: Throughout his career, Konishi has collaborated with notable colleagues such as Yoshihiro Kubota and Makoto Kawai. These partnerships have facilitated a rich exchange of ideas and fostered innovative solutions in their shared field, enhancing the overall impact of their work.

Conclusion: Shigeru Konishi has established himself as a leader in the development of high thermal conductivity substrates through his extensive patent portfolio and collaborative endeavors. His contributions to Shin-Etsu Chemical Co., Ltd. underscore the importance of innovation in technology, particularly in improving electronic devices’ thermal performance. As industries continue to demand more efficient thermal management solutions, inventors like Konishi remain at the forefront of driving change and technological advancement.