The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Nov. 19, 2013
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Shigeru Konishi, Annaka, JP;
Shozo Shirai, Annaka, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
Disclosed is a composite substrate manufacturing method whereby, after bonding a semiconductor substrate () and a supporting substrate () to each other, the semiconductor substrate () is thinned, and a composite substrate () having a semiconductor layer () on the supporting substrate () is obtained. On the supporting substrate () surface to be bonded, a coating film () containing polysilazane is formed, a silicon-containing insulating film () is formed by performing firing by heating the coating film () to 600-1,200° C., then, the semiconductor substrate () and the supporting substrate () are bonded to each other with the insulating film () therebetween, thereby suppressing bonding failures due to surface roughness and defects of the supporting substrate, and easily obtaining the composite substrate.