Sheng-Ming Wang

This inventor holds 28 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2009-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Ming Wang. Retrieved from https://idiyas.com/inventor/sheng-ming-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28

% Patents Active = 96.4

Average Co-Inventor Count = 4.3

ph-index = 5

Forward Citations = 63(Granted Patents)

Location History:

Taoyuan, TW (2009 - 2016)
Kaohsiung, TW (2018 - 2024)

Company Filing History:

28 out of 1,964

Advanced Semiconductor Engineering, Inc.

patents

Years Active: 2009-2025

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Areas of Expertise:

Semiconductor Package

Manufacturing Process

Substrate Structure

Heat Dissipation

Conductive Post

Glass Transition Temperature

3D Packaging

Thermal Management

Photo-Sensitive Resin

Protective Layer

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12444689 - Semiconductor package and method of manufacturing the same (2025-10-14),

2. 11894308 - Semiconductor package and method of manufacturing the same (2024-02-06),

3. 10879159 - Substrate, semiconductor package thereof and process of making same (2020-12-29),

4. 10854550 - Semiconductor package and method of manufacturing the same (2020-12-01),

5. 10734337 - Semiconductor package device having glass transition temperature greater than binding layer temperature (2020-08-04),

6. 10629519 - Semiconductor device package and method of manufacturing the same (2020-04-21),

7. 10573624 - Semiconductor device package and method of manufacturing the same (2020-02-25),

8. 10515884 - Substrate having a conductive structure within photo-sensitive resin (2019-12-24),

9. 10446411 - Semiconductor device package with a conductive post (2019-10-15),

10. 10332851 - Semiconductor device package and a method of manufacturing the same (2019-06-25),

11. 10224298 - Semiconductor package device having glass transition temperature greater than binding layer temperature (2019-03-05),

12. 10157887 - Semiconductor device package and method of manufacturing the same (2018-12-18),

13. 10134683 - Semiconductor device package and method of manufacturing the same (2018-11-20),

14. 10103110 - Semiconductor package structure and fabrication method thereof (2018-10-16),

15. 10049976 - Semiconductor substrate and manufacturing method thereof (2018-08-14),

Title: The Innovative Journey of Sheng-Ming Wang

Introduction: Sheng-Ming Wang, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Sheng-Ming Wang's latest patents include groundbreaking inventions in the realm of renewable energy and sustainable technologies, showcasing his commitment to creating a greener future.

Career Highlights: With a career spanning over two decades, Sheng-Ming Wang has established himself as a visionary inventor, with a keen focus on developing cutting-edge solutions to complex challenges. His work has been recognized globally for its ingenuity and impact.

Collaborations: Throughout his career, Sheng-Ming Wang has collaborated with leading research institutions, universities, and innovative companies to bring his inventions to life. His collaborative spirit has been instrumental in pushing the boundaries of technological advancement.

Conclusion: Sheng-Ming Wang's passion for innovation, coupled with his relentless drive to make a difference, has solidified his position as a trailblazing inventor in the world of technology. His contributions continue to inspire and shape the future of innovation.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]