The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Jan. 26, 2016
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Tien-Szu Chen, Kaohsiung, TW;
Chun-Che Lee, Kaohsiung, TW;
Sheng-Ming Wang, Kaohsiung, TW;
Kuang-Hsiung Chen, Kaohsiung, TW;
Yu-Ying Lee, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor substrate includes an insulating layer and a conductive circuit layer embedded at a surface of the insulating layer. The conductive circuit layer includes a first portion and a second portion. The first portion includes a bonding pad and one portion of a conductive trace, and the second portion includes another portion of the conductive trace. An upper surface of the first portion is not coplanar with an upper surface of the second portion. A semiconductor packaging structure includes the semiconductor substrate.