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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Tien-Szu Chen

This inventor holds 24 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tien-Szu Chen. Retrieved from https://idiyas.com/inventor/tien-szu-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 95.8

Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 52(Granted Patents)


Location History:

  • Taoyuan, TW (2014)
  • Zhongli, TW (2014 - 2016)
  • Kaohsiung, TW (2018 - 2024)

Company Filing History:

goldMedal24 out of 1,968 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Substrate
Conductive Posts
Circuit Layer Pads
Manufacturing Methods
Package Structure
Photo-Sensitive Resin
Thermal Management
3D Stacking
Bridging Mitigation
Device Packaging
Pillars
Fabrication Processes
24 patents (USPTO):Explore Patents
1. 12642109 - Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads (2026-05-26),
2. 12444689 - Semiconductor package and method of manufacturing the same (2025-10-14),
3. 11894308 - Semiconductor package and method of manufacturing the same (2024-02-06),
4. 11398421 - Semiconductor substrate and method for manufacturing the same (2022-07-26),
5. 10879159 - Substrate, semiconductor package thereof and process of making same (2020-12-29),
6. 10854550 - Semiconductor package and method of manufacturing the same (2020-12-01),
7. 10629519 - Semiconductor device package and method of manufacturing the same (2020-04-21),
8. 10573624 - Semiconductor device package and method of manufacturing the same (2020-02-25),
9. 10515884 - Substrate having a conductive structure within photo-sensitive resin (2019-12-24),
10. 10446411 - Semiconductor device package with a conductive post (2019-10-15),
11. 10332851 - Semiconductor device package and a method of manufacturing the same (2019-06-25),
12. 10181438 - Semiconductor substrate mitigating bridging (2019-01-15),
13. 10157887 - Semiconductor device package and method of manufacturing the same (2018-12-18),
14. 10134683 - Semiconductor device package and method of manufacturing the same (2018-11-20),
15. 10103110 - Semiconductor package structure and fabrication method thereof (2018-10-16),

Title: The Innovative Journey of Tien-Szu Chen

Introduction: Tien-Szu Chen, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Tien-Szu Chen holds several patents in various fields, including technology, healthcare, and sustainable energy. His most recent patents focus on advancements in renewable energy solutions and smart home technologies.

Career Highlights: Throughout his illustrious career, Tien-Szu Chen has been recognized for his innovative spirit and problem-solving abilities. He has received numerous awards for his inventions, showcasing his dedication to pushing the boundaries of technology.

Collaborations: Tien-Szu Chen has collaborated with leading research institutions, universities, and companies around the globe to further develop and implement his inventions. His collaborative efforts have resulted in the successful commercialization of several groundbreaking technologies.

Conclusion: Tien-Szu Chen's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventions. His contributions have not only transformed industries but have also inspired future generations of inventors to think outside the box and create a better tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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