The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Aug. 13, 2018
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Tien-Szu Chen, Kaohsiung, TW;
Kuang-Hsiung Chen, Kaohsiung, TW;
Sheng-Ming Wang, Kaohsiung, TW;
Yu-Ying Lee, Kaohsiung, TW;
Yu-Tzu Peng, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 24/05 (2013.01); H01L 24/14 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/92 (2013.01); H01L 24/96 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/5385 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/0217 (2013.01); H01L 2224/0218 (2013.01); H01L 2224/02175 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05562 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13027 (2013.01); H01L 2224/13028 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/24246 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92 (2013.01); H01L 2224/96 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H05K 1/144 (2013.01); H05K 3/284 (2013.01); H05K 2203/1316 (2013.01);
Abstract
A semiconductor package includes: (1) a substrate; (2) a first isolation layer disposed on the substrate, the first isolation layer including an opening; (3) a pad disposed on the substrate and exposed from the opening; (4) an interconnection layer disposed on the pad; and (5) a conductive post including a bottom surface, the bottom surface having a first part disposed on the interconnection layer and a plurality of second parts disposed on the first isolation layer.