Yu-Tzu Peng

Title: Innovations of Yu-Tzu Peng

Introduction

Yu-Tzu Peng is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of four patents. His work focuses on innovative methods and designs that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is a molding for large panel fan-out packages. This patent relates to wafer-level packages that include one or more semiconductor dies and outlines a method of manufacturing these packages. The method involves providing a carrier with a predetermined area, placing a semiconductor device on this area, and forming a sacrificial wall around the periphery. Another significant patent is for a semiconductor device package with a conductive post. This package includes a substrate, a first isolation layer with an opening, a pad exposed from the opening, an interconnection layer on the pad, and a conductive post with a bottom surface that has multiple parts interacting with the isolation layer and interconnection layer.

Career Highlights

Yu-Tzu Peng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor field. His expertise and dedication have made him a valuable asset to the company.

Collaborations

Some of his coworkers include Tien-Szu Chen and Kuang-Hsiung Chen, who contribute to the collaborative environment that fosters innovation within their team.

Conclusion

Yu-Tzu Peng's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a leading inventor in the industry. His innovative approaches continue to shape the future of semiconductor packaging.