The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Feb. 10, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Tien-Szu Chen, Kaohsiung, TW;
Kuang-Hsiung Chen, Kaohsiung, TW;
Sheng-Ming Wang, Kaohsiung, TW;
I-Cheng Wang, Kaohsiung, TW;
Wun-Jheng Syu, Kaohsiung, TW;
Yu-Tzu Peng, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes a first circuit layer having a first surface and a second surface opposite the first side, a first electronic component, a shielding element, a shielding layer and a molding layer. The first electronic component is disposed over the first surface of the first circuit layer, and electrically connected to the first circuit layer. The shielding element is disposed over the first surface of the first circuit layer, and is electrically connected to the first circuit layer. The shielding element is disposed adjacent to at least one side of the first electronic component. The shielding layer is disposed over the first electronic component and the shielding element, and the shielding layer is electrically connected to the shielding element. The molding layer encapsulates the first electronic component, the shielding element and a portion of the shielding layer.