The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Mar. 09, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Tien-Szu Chen, Kaohsiung, TW;
Kuang-Hsiung Chen, Kaohsiung, TW;
Sheng-Ming Wang, Kaohsiung, TW;
I-Cheng Wang, Kaohsiung, TW;
Wun-Jheng Syu, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes a first circuit layer, at least one electrical element, a first molding layer, an electronic component and a second molding layer. The at least one electrical element is disposed over a first surface of the first circuit layer and electrically connected to the first circuit layer. The first molding layer is disposed over the first surface of the first circuit layer. The first molding layer encapsulates an edge of the at least one electrical element, and a lower surface of the first molding layer and a lower surface of the at least one electrical element are substantially coplanar. The electronic component is disposed over a second surface of the first circuit layer and is electrically connected to the first circuit layer. The second molding layer is disposed over the second surface of the first circuit layer and encapsulates the electronic component.