The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Jul. 13, 2017
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Kuang-Hsiung Chen, Kaohsiung, TW;
Yu-Hsuan Tsai, Kaohsiung, TW;
Yu-Ying Lee, Kaohsiung, TW;
Sheng-Ming Wang, Kaohsiung, TW;
Wun-Jheng Syu, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); B81B 7/0006 (2013.01); B81C 1/0023 (2013.01); B81C 1/00333 (2013.01); H01L 21/563 (2013.01); H01L 23/3157 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0792 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13018 (2013.01);
Abstract
In one or more embodiments, a micro-electromechanical systems (MEMS) package structure comprises a MEMS die, a conductive pillar adjacent to the MEMS die, a package body and a binding layer on the package body. The package body encapsulates the MEMS die and the conductive pillar, and exposes a top surface of the conductive pillar. A glass transition temperature (Tg) of the package body is greater than a temperature for forming the binding layer (Tc).