Sen Mao

Title: The Innovative Contributions of Sen Mao

Introduction

Sen Mao is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His work focuses on advanced methods for fabricating stack die packages, which are crucial for enhancing the performance and efficiency of electronic devices.

Latest Patents

One of Sen Mao's latest patents is a method for fabricating a stack die package. In this embodiment, the method includes coupling a gate and a source of a first die to a lead frame. The first die features the gate and source on its first surface, while a drain is located on the opposite surface. Additionally, the method involves coupling a source of a second die to the drain of the first die. The second die also has a gate and source on its first surface, with a drain on its second surface, facing the drain of the first die. Another notable patent is the stack die package itself, which includes a lead frame and a first die with similar configurations as described above.

Career Highlights

Sen Mao has worked with several notable companies throughout his career, including Vishay Siliconix and Siliconix Incorporated. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Sen has collaborated with talented individuals in the industry, including Frank Kuo and Mohammed Kasem. These partnerships have fostered an environment of creativity and innovation, leading to the development of advanced technologies.

Conclusion

Sen Mao's contributions to the field of semiconductor packaging are noteworthy and impactful. His innovative methods and patents continue to influence the industry, showcasing his dedication to advancing technology.