For the Inventor, By the Inventor

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Kaohsiung, Taiwan

Siliconix Taiwan Ltd

USPTO Granted Patents = 2

Forward Citations = 12

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4 inventors (with patents filed for the assignee):

Frank Kuo (2 out of 21 patents)

Sen Mao (1 out of 11 patents)

Sam Kuo (1 out of 5 patents)

4. Oscar Ou (1 out of 4 patents)

2 patents: Sort by Forward Citations

1. 6856006 - Encapsulation method and leadframe for leadless semiconductor packages (2005-02-15),

2. 6744119 - Leadframe having slots in a die pad (2004-06-01),

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USPTO Data Jan 1 1976 - Dec 30 2025

2 Patents

#126 in Kaohsiung

#4,112 in Taiwan

Kaohsiung, Taiwan

Siliconix Taiwan Ltd

Forward Citations = 12

4 inventors:

Frank Kuo (2 out of 21 patents)

Sen Mao (1 out of 11 patents)

Sam Kuo (1 out of 5 patents)

4. Oscar Ou (1 out of 4 patents)

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