Oscar Ou

Title: Oscar Ou: Innovator in Semiconductor Packaging

Introduction

Oscar Ou is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative designs have advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

One of Oscar Ou's latest patents is titled "Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys." This patent describes a semiconductor package that features a die interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame is designed with contacts that align with the terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and its edges are bent downward around the die, creating a cup shape. This design allows all contacts of the package to be coplanar, facilitating surface mounting on a printed circuit board. The terminals of the die are electrically connected to the lead frames through solder layers, with their thicknesses predetermined to optimize performance through numerous thermal cycles. This is achieved by fabricating the lower lead frame with multiple mesas and employing a double solder reflow process.

Another notable patent by Oscar Ou is the "Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys." This patent shares similar features with the previous one, emphasizing the innovative approach to semiconductor packaging that enhances thermal performance and reliability.

Career Highlights

Oscar Ou has worked with notable companies in the semiconductor industry, including Siliconix Incorporated and Siliconix Taiwan Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and packaging solutions.

Collaborations

Throughout his career, Oscar Ou has collaborated with talented individuals such as Frank Kuo and Sen Mao. These collaborations have fostered innovation and the development of advanced semiconductor technologies.

Conclusion

Oscar Ou's contributions to semiconductor packaging have made a significant impact on the industry. His innovative patents and collaborations reflect his dedication to advancing technology in this critical field.