The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2004
Filed:
Oct. 15, 2001
Applicant:
Inventors:
Assignee:
Siliconix (Taiwan) Ltd., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ; H01L 2/322 ; H01L 2/324 ; H01L 2/304 ; H01L 2/312 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/3495 ; H01L 2/322 ; H01L 2/324 ; H01L 2/304 ; H01L 2/312 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
A die pad ( ) of a leadframe ( ) has a plurality of slots ( ) that extend through the die pad to define a restrictive region ( ). One of the slots extends around a comer of the restrictive region outside where a die ( ) is connected to the die pad by solder paste ( ). Because of the cohesion of the solder paste, the solder paste does not flow into the slots. The solder paste is thereby restricted to the restrictive region. This prevents the die from drifting or rotating so as to increase the packaging quality.